AUOLLY™ Pretreatment for Aurum Plating
- A mild acid pretreatment for aurum plating;
- Enhance the bonding power;
- Minimize the possibility of bath contamination;
- Uses stainless steel as the anode; contains only 1g/L Aurum; very economical
- Suggestion for better result: wash the work pieces with pure water after using AUOLLY™ Pretreatment for Aurum Plating
AUOLLY™ AC Acid-based Hard Aurum Plating Process
- Stable and easy to operate; contains cobalt;
- Excellent in corrosive and abrasion resistance;
- Shinny and hard deposit ( 120~190HV);
- Good solder ability and low in contact resistance (0.6mΩ);
- Suitable for barrel, rack and optional, continuous plating;
- Ideal for electronic devices such as circuit board plugs.
AUOLLY™ AI Hard Aurum Plating Process
- An acid hard aurum plating process;
- Aurum-cobalt deposit with 99.9% aurum;
- Excellent ductility and abrasion resistant (Hardness of deposit: 140-145HV);
- Suitable for circuit boards, plugs and switches.
AUOLLY™ AHD High Speed Aurum Plating Process
- Aurum-cobalt deposit with 99.8%, aurum content
- Excellent abrasion resistance (Hardness of deposit: 170~180HV);
- High current density and good throwing power;
- Great mechanical, physical and chemical properties; ideal for various kinds of optional plating, including electronics and electrical appliances.
AUOLLY™ Aurum Immersion Plating Process
- Capable of accumulating a thin 24K aurum deposit on the surface of Nickel Phosphorus Alloy;
- Fine, Smooth and Bright deposit;
- Economical operation: bath can be replenished.
CIRCUM-BRITETM CU8100HF Anti-oxidation Copper Protector
- Chromate-Free anti-oxidant for Copper and Electroless Copper
- Enhance solder ability and corrosion resistance power for Copper and Electroless Copper
- Economical & Environmental-friendly
- Suitable for processes required high flash point
CIRCUM-BRITETM 2000 Bright Acid Copper Plating Process
- Shinny deposit
- Excellent leveling power;
- Stress-free deposit is suitable for heat cycle test;
- Stable solution, not affected by decomposed substance;
- Ideal for perforated electroplating: capable for forming shinny & smooth deposit and frequent carbon treatment is not required.
Ductile-Ni HSNSM High Speed Low Stress Sulfamate Nickel Plating Process
- Design for high performance soluble anodise plating;
- Semi-bright deposit with low stress and good ductility;
- Ideal for the bottom layer of precious and non-precious metals.
Ductile-Ni HSNS High Speed Low Stress Sulfate Nickel Plating Process
- Design for high performance soluble anodise plating;
- Semi-bright deposit with low stress and good ductility;
- Ideal for the bottom layer of precious and non-precious metals.
- Best fit for Printed Circuit Board, Plug-In Connectors, Semi-Conductors, Solid Circuit and Electronic Components
Ductile-Ni NSM Low Stress Sulfamate Nickel Plating Process
- Easy to operate: Ready-to-use make-up solution; no need to dilute or go through carbon treatment before use;
- Semi-bright fine deposit with low stress and good ductility;
- Ideal for the bottom layer of precious and non-precious metals
- Best fit for Printed Circuit Board, Plug-In Connectors, Semi-Conductors and Electronic Components
Ductile-Ni NS Low Stress Nickel Plating Process
- Deposit with almost NO stress
- Ideal for the bottom layer of precious metals (aurum, palladium, rhodium, silver) or layer between decorative chromium.
- Best fit for printed circuit boards, wires, plug-in connectors, spring plates and electronic components
Ductile-Ni R-HT Pre-tinned Nickel Plating Process
- Semi-bright deposit with good solder ability, ductility (25-30%) and hardness (250-450HV)
- Ideal for the bottom layer of electronic parts and mechanic hardware’s tin coating
- Best Fit for Electronics goods with high requirements.
SILVERMAX™ Hard Bright Silver Plating Process
- Organic, stable, wide working current density range (1.0-2.5A/dm2);
- Enhance the corrosive resistance of the base metal;
- Formed deposit: durable, hard (100-110VPN), mirror bright (even without buffering) and tolerate high temperature (180°C);
- Decompose NO harmful substance;
- Suitable for barrel and rack plating and ideal for both decorative (such as labels & tableware) and functional (antenna & electronics) plating.
SILVERMAX™ AGS Water Soluble Silver Protector
- Non-toxic, non-irritated water-soluble anti-oxidant for Silver;
- Deposit: a hydrophobic coating prevents silver parts from oxidation;
- Good solder ability and low contact resistance;
- Ideal for jewelry, accessories, utensils with flat surface or in tube-shape and electric connector.
STANNOMAX™ HSB 100 High-Speed Bright Pure Tin Plating Process
- Fine bright deposits with the least organic substances and excellent solder ability;
- Stable performance under different temperature range;
- Ideal for electronic parts plating.
STANNOMAX™ HSM 100 High-Speed Pure Matt Tin Plating Process
- Lead-free process design for medium- to high-speed plating;
- Smooth deposit with the least organic substance;
- Wide working range for temperature and electric current density;
- Excellent covering power, ductility and solder ability;
- Ideal for terminal, cables and wires plating.
